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Meet The ICPT 2022 Committee
International Executive Committee
China
Xinchun Lu,
Tsinghua University
Xin-Ping Qu,
Fudan University
Europe
Knut Gottfried,
Fraunhofer ENAS, Germany
Viorel Balan,
CEA-LETI, France
Korea
Jin-Goo Park,
Hanyang University
Taesung Kim,
Sung Kyun Kwan University (SKKU)
Taiwan
Eddy Peng,
Hanmin Technology Co., Ltd.
Willie Pai,
Kinik Company
United States
Rob Rhoades,
X-trinsic
Gene Davis,
Texas Instruments
Japan
Yukiteru Matsui,
KIOXIA Corporation
Syuhei Kurokawa,
Kyushu University
International Program Committee
China
Yuchun Wang,
Anji Microelectronics
Baoguo Zhang,
Hebei University of Technology
Weili Liu,
Institute of Microsystems, CAS
Kun Li,
Tianjin Hwatsing Technology
Europe
Catharina Rudolph,
Fraunhofer IZM-ASSID
Eric Jacquinot,
Merck Performance Materials
Patrick Ong,
IMEC
Cedric Perrot,
STMicroelectronics
Korea
Kwangsu Kim,
Daelim University
Taegon Kim,
Hanyang University
Sanha Kim,
KAIST
Hyunseop Lee,
Dong-A University
Taiwan
Kuo Chun Wu,
Cabot Microelectronics
Chao-Cheng Arthur Chen,
NTUST
Ming-shih Tsai,
VERSUM Materials
United States
Mark Buehler,
Intel
Mahadevaiyer Krishnan,
IBM
Don Frye,
Entegris
Andrew Carswell,
Micron
Japan
Michio Uneda,
Kanazawa Institute of Technology
Kazumi Sugai,
Fujimi Inc
Norikazu Suzuki,
Nagoya University
Yasuhisa Sano,
Osaka University
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