Meet The ICPT 2022 Committee

International Executive Committee

China
Xinchun Lu,
Tsinghua University
Xin-Ping Qu,
Fudan University

Europe
Knut Gottfried,
Fraunhofer ENAS, Germany
Viorel Balan,
CEA-LETI, France

Korea
Jin-Goo Park,
Hanyang University
Taesung Kim,
Sung Kyun Kwan University (SKKU)

Taiwan
Eddy Peng,
Hanmin Technology Co., Ltd.
Willie Pai,
Kinik Company 

United States
Rob Rhoades,
X-trinsic
Gene Davis,
Texas Instruments

Japan
Yukiteru Matsui,
KIOXIA Corporation
Syuhei Kurokawa,
Kyushu University

International Program Committee

China
Yuchun Wang,
Anji Microelectronics
Baoguo Zhang,
Hebei University of Technology
Weili Liu,
Institute of Microsystems, CAS
Kun Li,
Tianjin Hwatsing Technology

Europe
Catharina Rudolph,
Fraunhofer IZM-ASSID
Eric Jacquinot,
Merck Performance Materials
Patrick Ong,
IMEC
Cedric Perrot,
STMicroelectronics

Korea
Kwangsu Kim,
Daelim University
Taegon Kim,
Hanyang University
Sanha Kim,
KAIST
Hyunseop Lee,
Dong-A University

Taiwan
Kuo Chun Wu,
Cabot Microelectronics
Chao-Cheng Arthur Chen,
NTUST
Ming-shih Tsai,
VERSUM Materials



United States
Mark Buehler,
Intel
Mahadevaiyer Krishnan,
IBM
Don Frye,
Entegris
Andrew Carswell,
Micron

Japan
Michio Uneda,
Kanazawa Institute of Technology
Kazumi Sugai,
Fujimi Inc
Norikazu Suzuki,
Nagoya University
Yasuhisa Sano,
Osaka University