ICPT 2022
International Conference on Planarization Technology
Call for Abstracts!
2022 International Conference on Planarization Technology (ICPT 2022)
September 27 – 29, 2022
The Benson Hotel
Portland, OR USA
ICPT 2022 provides the largest forum for academic researchers, industrial practitioners, and engineers from around the world dedicated to the exchange of information on the state-of-the-art in Chemical Mechanical Polishing (CMP) and other planarization technologies. Abstracts of new work are requested and can include the following topics relating to planarization:
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Transistor and interconnect CMP applications
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3D ICs/TSV/packaging applications
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CMP for emerging technologies such as MEMS/LEDs/power devices
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Process integration, process control & reliability
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Consumables, equipment, and metrology
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Defects and Post CMP cleaning
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CMP fundamentals, modeling, and simulation
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Environmental issues related to CMP
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Alternative planarization technologies
Important Dates:
Abstract Submission Extended Deadline: May 16, 2022
Notification of Abstract Acceptance: June 15, 2022
All materials (videos, slides, etc.) to be shared virtually on Engagez due: September 1, 2022
Final Manuscripts Due: September 15, 2022
Abstracts should be a maximum of one page and a minimum of 200 words, written in English, and may include figures. Abstracts will be scored according to the originality and significance of the work as well as the quality of the information and data included. The ideal abstract will be for novel work done in an area of great importance to the industry and include the data that helps prove the conclusions made. Please indicate the preference of oral or poster presentation, and the targeted topic area when submitting the abstract. Presentation of accepted papers at the conference must be in English. Full-length papers, including figures and references, will be limited to 4-8 pages for oral presenters and 3-4 pages for poster presenters. The full text of conference oral and poster papers will be published via an electronic format yet to be determined and available to all attendees. Please note that the conference will be in a hybrid format (both in-person and virtual) so those submitting their work will have flexibility. Physical attendance of the live meeting will not be required to share one's work.